Features and areas of application of heat-conducting glue, an overview of the best brands and how to do it yourself
When installing heat sinks, you cannot use ordinary glue. To work with such parts, a special solution is required, which is exposed to high temperatures. When choosing a solution, you should pay attention to the characteristics of a thermally conductive adhesive, since different manufacturers offer products with distinctive characteristics.
Description and scope
The thermally conductive adhesive is designed for use under conditions of temperature changes. AT high and low temperatures, the created compound does not lose its properties. The solution is indispensable for the installation of LED components, radiators and other electronic devices.
Due to the wide spectrum of action of the heat-conducting solution, it can be considered a universal remedy. It is suitable for graphite, metal and plastic applications. Also, a high-quality result can be achieved when the substance is applied to glass and ceramic surfaces. Offering strong adhesion, this type of adhesive is used in many industries.
Main characteristics of thermally conductive adhesives
Regardless of brand and manufacturer, all thermally conductive solutions have a list of standard features. The main features are:
- To firmly bind the elements and protect them from deformation and overheating, the solution removes heat from the elements, which tend to heat up during operation.
- Suitable for use in a wide temperature range.
- Non-toxicity and the absence of hazardous components in the composition, which allows it to be used in a residential environment.
- The solution is resistant to water, the external atmosphere and direct exposure to ultraviolet rays.
- After application, the adhesive does not cause the development of corrosion of aluminum alloys, silver coatings and various types of steel.
Review of popular brands
When choosing a suitable thermally conductive solution, it is recommended to familiarize yourself with the most popular brands. Products from the best manufacturers are appreciated for their high quality and strong connection of components.
Manufacturers produce several types of thermally conductive adhesives under different brands, including natural and synthetic. The latter also contain plasticizers, which make them resistant to moisture and frost. Both types of solutions are used for installation work with metal, ceramic and glass products. The difference between natural and synthetic solutions lies in the quality of the composition and the final cost.
"Radial"
The radial adhesive solution is suitable for mounting LEDs and heat sink fittings to transistors and processors in situations where it is not possible to apply heat-conducting paste.
Most often, the need to use this glue arises when the attachment of the transistor, processor to the radiator is not provided for by the design or has defects.
When applied, "Radial" glue provides stable and high-quality heat dissipation without losing its characteristics in the temperature range from -60 to +300 degrees. A distinctive feature of the products of this brand is slow drying, which allows it to retain its plasticity for a long time after being squeezed out of the tube.
"AlSil"
Hot glue "AlSil" is a modern composition for screwless mounting of radiators, cooling systems and other structures that require heat removal. Often glue is used on memory cards of laptops and system units.
The composition is supplied in a syringe weighing approximately 3 g, which facilitates its application on the countertop. The "AlSil" solution is distinguished by its economical consumption, since it can be applied from a syringe in a thin layer.
GD9980
GD9980 heat transfer compound is used to move accumulated air between the surface of the microcircuit and the base of the heat sink. The heat dissipation property of the glue of this brand is inferior to that of the products of other manufacturers, but the composition GD9980 is able to fix parts on the processor with special strength, attaching heat sinks to motherboards, RAM slots and video card microcircuits.
General application rules
The process of gluing parts directly depends on the composition. Some solutions should be applied over the entire surface, while others should be applied exclusively by the stippling method.You should also check in advance in what form the glue was created - a solution or a mixture. The liquid variety dries quickly, which can be difficult to use.
Dry formulations are easy to use and cost less than other options.
The nuances of using a thermally conductive solution depend on the type of surface on which the work is carried out. When connecting metal elements, you must adhere to a special technique, which involves a point effect on the working surface. An epoxy compound with synthetic plasticizers and additives is suitable for processing metal components. For ceramics, it is better to use a solution that contains in its composition a combination of cement and sand, since this combination improves the plasticity indicator. It is recommended to work on a glass surface using glue with organic compounds, which help not to disturb the transparency of the material.
The general order of use is sequential execution of simple steps. Including:
- The surfaces of the heat source and the heat exchanger are pre-degreased with alcohol or acetone.
- A small amount of the substance is applied to the prepared surfaces and the parts are fixed with applied force for 15 minutes.
- The product is left for a day to completely dry the solution.
- The syringe containing the substance is tightly closed after use.
How to stick a heat sink on a microcircuit
To securely attach the heatsink to the microcircuit of the board, it is enough to follow the standard instructions. A thin layer of glue solution is applied to the surface of the microcircuit, a radiator is placed on top and pressed with a small weight.Drying will take several hours, but it is recommended not to touch the glued parts for 24 hours.
How to do it yourself
To make thermally conductive adhesive, you must first prepare glycerin cement. It is durable, high operating temperature and resistant to external influences. Glycerin in an amount of 25 ml is heated to a temperature of 200 degrees to remove water. In a separate container, 100 g of lead oxide powder is heated to 300 degrees. The two components are cooled and mixed.
You need to prepare homemade glue immediately before use. After application, the mass hardens in 15-20 minutes. For the same reason, do-it-yourself mass is also not subject to storage.